Hard and brittle material machining model
Applications in manufacturing for industries such as aerospace and semiconductors.
Monocrystalline silicon, polycrystalline silicon, and silicon carbide,etc
JTGK-800G2 High-speed CNC Grinding Center
Hard and brittle material machining model
Applications in manufacturing for industries such as aerospace and semiconductors.
Monocrystalline silicon, polycrystalline silicon, and silicon carbide,etc
JTGK-800G2 High-Speed CNC Grinding Center, Specialized in Precision Grinding of Hard and Brittle Materials.
Featuring Jiatie's independently developed high-speed turntable, it supports multi-mode processing (three-axis fixed-angle, independent rotation, polar coordinate linkage), effectively solving the pain points of hard and brittle material machining: high loss, cumbersome procedures and unstable precision.
Long-term continuous stable operation, accurately meeting strict precision requirements.
Proven vibration damping technology extends tool life significantly.
Customizable Features – Tailored for clients' specific needs.
| Items | Technical Parameter |
| X/Y/Z travel | 800/700/400mm |
| Work table dimension | 850×700mm |
| Max workpiece height | 400mm |
| Max load of worktable | 800kg |
| Machine net dimension | 2370×2630×2760mm |
| Machine net weight | 10000kg |
| Click for details in PDF | Specification Download |
High RPM High Accuracy for Hard to cut Material
Machining for industry applications of aviation and aerospace, medica product,semi-conductor,etc
glass, ceramic, sapphire,silicon carbide, silicon nitride and etc,titanium,engineering plastics
High RPM High Accuracy for Hard to cut Material
Machining for industry applications of aviation and aerospace, medicaproduct,semi-conductor,etc
glass, ceramic, sapphire,silicon carbide, silicon nitride and etc,titanium,engineering plastics
one-stop overall solutiondedicated for the special cutting processing requirements of MiniLED.
Application area:Semi-Conductor
Machining material:MiniLED
High RPM High Accuracy for Hard to cut Material
Machining for industry applications of aviation and aerospace, medicaproduct,semi-conductor,etc
glass, ceramic, sapphire,silicon carbide, silicon nitride and etc,titanium,engineering plastics
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