Micron-level precision machining, ultra-precision machining capability
For mold and semiconductor key component manufacturing
High-hardness copper, quenched steel, high-speed die steel, new hard and brittle materials, etc

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Micron-level precision machining, ultra-precision machining capability
For mold and semiconductor key component manufacturing
High-hardness copper, quenched steel, high-speed die steel, new hard and brittle materials, etc





Integrated design & new high-rigidity structure, with mature vibration damping and long-stable temperature control, dynamic response accuracy up to 0.1 μm.
Long-term precision stability control ensures prolonged continuous stable machining, while maintaining an excellent mirror finish and clear font depth difference with outstanding precision performance.

Robust full-machine structural design, Precise spindle temperature control, Temperature control technology limiting full-machine temperature deviation to within 0.5℃.
Equipped with the self-developed JT-810 CNC system featuring AI multimodal control, the machine achieves steady performance and reliable operation in ultra-precision machining.

Lightweight moving components makes machine travel speed higher.
Perfectly handles high-precision machining scenarios such as micro-features, small-diameter hole milling, 2D/3D precision milling, as well as acute-angle and diamond surfaces.





| Items | Technical Parameter |
| X/Y/Z travel | 500/400/250mm |
| Max workpiece height | 550x410x260mm |
| Max load of worktable | 200kg |
| Machine net dimension | 2050×2000×2350mm |
| Machine net weight | 6000kg |
| Click for details in PDF | Specification Download |
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